TPM/Packaging Engineer

Ledgent

Sunnyvale, CA

Full Time

Senior

about 2 months ago

Job Description

About the Role

As a Technical Program Manager (TPM) specializing in Packaging Development, you will play a critical role in supporting the Engineering and Sales teams. This position requires a strong understanding of semiconductor packaging and its applications to drive technical programs and enhance customer collaboration.

Key Responsibilities

Support the Engineering and Sales teams in Technical Program Management.
Coordinate and manage technical activities to maximize revenue with current and prospective customers in close collaboration with internal Sales teams.
Work directly with customers' engineering teams to select or develop packaging technologies tailored to their device/product requirements.
Partner with the Sales team to promote solutions and drive revenue growth.
Collaborate with cross-functional teams to establish plans, define key milestones, and achieve program objectives.

Requirements

BS or master's degree in engineering or science.
5+ years of experience in semiconductor packaging development and/or manufacturing, including expertise in assembly and test processes.
Strong technical knowledge of the IC assembly and test processes and requirements, especially in offshore assembly facilities.
Proficiency in Microsoft Office Suite, including PowerPoint, Excel, and Word.
In-depth technical expertise in all phases of IC packaging processes and equipment.
Familiarity with advanced packaging technologies such as 2.5D, Fanout, and Silicon Photonics is a significant advantage.
Ability to manage key technical programs and provide package design support to customers.
Experience working with customers and stakeholders to resolve technical issues and make sound business decisions to ensure program success.